VoxelSensors to advance next-generation Depth Sensing Technology with 10x power savings for XR applications

VoxelSensors, a company developing novel intelligent sensing and data insights technology for Physical AI, today announced a collaboration with Qualcomm Technologies, Inc. to jointly optimize VoxelSensors’ sensing technology with Snapdragon® XR Platforms.

Technology & Industry Challenges

VoxelSensors has developed Single Photon Active Event Sensor (SPAES™) 3D sensing, a breakthrough technology that solves current critical depth sensing performance limitations for robotics and XR. The SPAES™ architecture addresses them by delivering 10x power savings and lower latency, maintaining robust performance across varied lighting conditions. This innovation is set to enable machines to understand both the physical world and human behavior from user’s point-of-view, advancing Physical AI.

Physical AI processes data from human perspectives to learn about the world around us, predict needs, create personalized agents, and adapt continuously through user-centered learning. This enables new and exciting applications previously unattainable. At the same time, Physical AI pushes the boundaries of operation to wider environments posing challenging conditions like variable lighting and power constraints.

VoxelSensors’ technology addresses both challenges by offering a technology that expands the operative limits of current day sensors, while collecting human point-of-view data to better train physical AI models. Overcoming these challenges will define the future of human-machine interaction.

Collaboration

VoxelSensors is working with Qualcomm Technologies to jointly optimize VoxelSensors’ SPAES™ 3D sensing technology with Snapdragon AR2 Gen 1 Platform, allowing a low-latency and flexible 3D active event data stream. The optimized solution will be available to select customers and partners by December 2025.

More information on VoxelSensor's website.